February 28th, 2019 – By: Ann Steffora Mutschler
Rising costs, tighter market windows and more heterogeneous designs are forcing chipmakers to rethink fundamental design approaches.
Semiconductor engineers traditionally have focused on trying to create ‘perfect’ GDSII at tape-out, but factors such as hardware-software interactions, increasingly heterogeneous designs, and the introduction of AI are forcing companies to rethink that approach.